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12 Layer Multilayer HDI Printed Circuit Board High Density Electronics PCB Manufacturing

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

12-Layer

Material:

FR-4

Board Thickness:

1.0mm (Customizable)

Copper Thickness:

1/1/1/1/1/1/1/1/1/1oz

Surface Finish:

OSP

Supply Ability:

1 Million Square feet/per month

Highlight:

Multilayer HDI Printed Circuit Board

12 Layer HDI Printed Circuit Board

High Density Electronics PCB Manufacturing

Product Description

12 Layer Multilayer HDI PCB with Stacked Blind Vias for High-Density Electronics

The manufacturing process focuses on precise dual-laser alignment control. First- and second-stage blind vias are formed through sequential laser drilling, with cumulative microvia offset maintained within ≤25μm. Each laser drilling system is monitored through Statistical Process Control, maintaining a process capability index (CPK) of ≥1.33 to ensure consistent production quality.

To optimize black solder mask performance, exposure energy grid testing is conducted before production. The process ensures complete development and eliminates residue inside blind vias, preventing reliability issues during assembly.

Key Specifications

Layer Count	12-Layer
Material	FR-4
Board Thickness	1.0 mm (Customizable)
Copper Thickness	2/1/1/1/1/1/1/1/1/1/1/2 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Black
Surface Finish	OSP

Product Description

Advanced 2+N+2 HDI Structure

Two-step HDI architecture with stacked laser microvias.
Higher routing density for complex multilayer designs.
Supports miniaturized and high-performance electronic products.

Precision Dual-Laser Alignment Control

Sequential laser drilling process for stacked blind vias.
Cumulative blind-via offset controlled within ≤25μm.
Improves interconnection reliability and electrical performance.

High Process Capability Manufacturing

Laser drilling equipment maintained at CPK ≥1.33.
Stable production consistency across volume manufacturing.
Reduced variation and improved yield rates.

Black Solder Mask Optimization

Professional exposure energy grid testing before production.
Enhanced process control for black solder resist applications.
Suitable for high-density circuit patterns and fine-pitch designs.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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