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Communication PCB
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2 Step HDI Communication PCB Immersion Gold 8 Layer PCB Manufacturer

2 Step HDI Communication PCB Immersion Gold 8 Layer PCB Manufacturer

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
8-Layer
Material:
FR4
Board Thickness:
1.2mm
Copper Thickness:
1/0.5/0.5/0.5/0.5/0.5/0.5/1 Oz
Minimum Hole Size:
0.1 Mm
Minimum Line Width:
0.05 Mm
Minimum Line Spacing:
0.075 Mm
Supply Ability:
1 Million Square feet/per month
Highlight:

HDI Communication PCB

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2 Step Communication PCB

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HDI 8 Layer PCB Manufacturer

Product Description
Key Specifications
Layer Count 8-Layer
Material FR4
Board Thickness 1.2mm
Copper Thickness 1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.05 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Green
Surface Finish ENIG
Application Field Used in the communication field.

Product Description:

Product Name: HDI Printed Circuit Board Material: FR-4 Copper Thickness: 1/2 oz Layer Count: 8 layers Lead Time: 12-15 days Minimum Silkscreen Gap: 0.15 mm, ensuring precise and accurate design

  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm