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Polyimide PI Double Layer Printed Circuit Board Digital LED PCB Manufacturing

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

2-Layer

Material:

Board Thickness:

0.6 Mm (Customizable)

Copper Thickness:

0.5/0.5 Oz

Surface Finish:

OSP

Supply Ability:

1 Million Square feet/per month

Highlight:

PI Double Layer Printed Circuit Board

Polyimide Double Layer Printed Circuit Board

Digital LED PCB Manufacturing

Product Description

Double Layer Printed Circuit Board For digital LED

The Double Layer Printed Circuit Board for Digital LED is designed for LED display modules, digital signage, LED lighting systems, advertising screens, and intelligent display applications. Featuring a double-sided circuit layout, this PCB provides enhanced routing capability, improved electrical performance, and higher component density compared to single-layer boards.

Key Specifications

Layer Count	2-Layer
Material	Polyimide (PI)
Board Thickness	0.6mm (Customizable)
Copper Thickness	0.5/0.5 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	White
Surface Finish	OSP

Product Description

Double-Layer PCB Structure
- Copper circuits on both sides of the board increase routing flexibility.
- Supports more complex LED control and power management circuits.
Optimized for Digital LED Applications
- Designed for LED displays, digital signage, LED modules, and intelligent lighting systems.
- Ensures stable operation of LED driver and control circuits.
Excellent Electrical Performance
- Reliable signal transmission for digital control systems.
- Reduces signal interference and improves display performance.
Efficient Power Distribution
- Double-sided circuit design improves current flow and voltage stability.
- Suitable for high-brightness LED applications.
Good Thermal Management
- Optimized copper layout helps dissipate heat generated by LEDs and driver components.
- Enhances product lifespan and operational reliability.

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm